As a partner of the Ryzen 3000 processor, the X570 motherboard is equipped with the latest PCIe 4.0 technology to support up to eight USB3.1 Gen2 interfaces, while also attracting attention due to the unique fan heatsink. What is the level of power consumption of 11 watts in the chipset? Should we worry about its heat dissipation?
Why did TDP rise to 14 watts:
The graphics card can save power by reducing the PCIe link rate when idle, which illustrates the higher power consumption of the high-speed PCIe standard. For the first time, the AMD X570 chipset supports PCIe 4.0, which links to the same CPU and links to various PCIe devices.
In the past, when the North Bridge was not absorbed into the CPU, the motherboard model was named after the North Bridge chip. The North Bridge chip communicates directly with the CPU, and is responsible for high-speed signals such as memory and PCIe. The South Bridge is connected to the North Bridge and is responsible for managing or connecting low-speed devices such as PCI bus, USB interface, LAN network interface, and sound card. The TMD of the AMD 890GX North Bridge is 22 watts, and the SB850 South Bridge TDP with it is 6 watts. The picture below shows the 890GX main board with a large metal heat sink on the North Bridge.
The North Bridge has disappeared into the long river of history. Today, the X570 also assumes the functions of the South Bridge and some North Bridges (high-speed communication). It is not difficult to understand the power consumption.
Actual operating power consumption is slightly lower than 11 watts:
Germany's der8auer recently measured the real-time power consumption of the X570 chipset by flying lines.
与X470芯片组相比，可以发现连接单个NVMe SSD后，X570芯片组在硬盘活动和空闲状态下的功耗低于X470。目前还不清楚X570芯片组的PCIe ASPM节能特性是否与X470明显不同。 PCEVA将继续关注这些信息。